| PART |
Description |
Maker |
| HN7G01FU |
Multi Chip Discrete Device Power Management Switch Application Driver Circuit Application Interface Circuit Application
TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
| CMLM0205 |
MULTI DISCRETE MODULE SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE??SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE⑩ SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE?/a> SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
|
CENTRAL[Central Semiconductor Corp]
|
| HN2E04F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation
Toshiba Semiconductor
|
| CTLM1034-M832D |
MULTI DISCRETE MODULE 垄芒 SURFACE MOUNT LOW VCE (SAT) SILICON NPN TRANSISTOR AND LOW VF SILICON SCHOTTKY RECTIFIER
MULTI DISCRETE MODULE ?SURFACE MOUNT LOW VCE (SAT) SILICON NPN TRANSISTOR AND LOW VF SILICON SCHOTTKY RECTIFIER
|
Central Semiconductor Corp
|
| 2SJ221 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0611-3 05; No. of Positions: 8; Connector Type
Silicon P-Channel MOS FET
|
Hitachi,Ltd.
HITACHI[Hitachi Semiconductor]
|
| HGT1S7N60A4DS9A |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0692-5 53; Contact Mating Area Plating: Gold 晶体管| IGBT的|正陈| 600V的五（巴西）国际消费电子展|4A一（c）|63AB
|
Intersil, Corp.
|
| SCN2652 SCN2652AC2N40 SCN68652 SCN68652AC2A44 SCN2 |
Multi-protocol communications controller (MPCC)
HEATSINK TO-220 W/SHURLOCK-CLIP 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, CDIP40
Multi-protocol communications controller MPCC 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, PQCC44
Multi-protocol communications controller MPCC 1 CHANNEL(S), 2M bps, MULTI PROTOCOL CONTROLLER, PDIP40
Multi-protocol communications controller MPCC 多协议通信控制器茂
(SCN2652 / SCN68652) Multi-protocol communications controller MPCC
|
NXP Semiconductors N.V.
Philips Semiconductors
|
| HI1-774J5 HI3-674ALD5 HI3-674ATD/883 HI1-774AK5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0525-5 91; Contact Mating Area Plating: Gold
Converter IC 转换IC
Converter IC 转换器IC
|
Rochester Electronics, LLC
Intersil, Corp.
|
| 10TQ045S 10TQ040S 10TQ030S 10TQ035 10TQ 10TQ045 10 |
SCHOTTKY RECTIFIER 肖特基整流器
35V 10A Schottky Discrete Diode in a D2-Pak package 35V0A条肖特基二极管的分立的一D2 - PAK封装
40V 10A Schottky Discrete Diode in a D2-Pak package
35V 10A Schottky Discrete Diode in a TO-220AC package
45V 10A Schottky Discrete Diode in a TO-220AC package
45V 10A Schottky Discrete Diode in a D2-Pak package
|
International Rectifier, Corp.
SIEMENS AG
IRF[International Rectifier]
|
| 2SJ327 2SJ327-Z 2SJ327-Z-T1 2SJ327-Z-E2 2SJ327-Z-T |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0620-4 00; No. of Positions: 6; Connector Type: Panel
SWITCHING P-CHANNEL POWER MOS FET INDUSTRIAL USE
P-channel enhancement type
|
NEC Corp.
NEC[NEC]
|
| SST39LF016 SST39LF016-90-4I-EI SST39VF016-90-4I-EI |
(SST39VF080 / SST39VF016 / SST39LF080 / SST39LF016) 8 Mbit / 16 Mbit (x8) Multi-Purpose Flash
7.6 mm(0.3 inch) Micro Bright Seven Segment Displays
CONNECTOR ACCESSORY
LED Light Bars
D52 - BACKSHELL ENVIRON EMI-RFI STRT MIL 2M X 8 FLASH 2.7V PROM, 70 ns, PBGA48
64 Mbit (x16) Multi-Purpose Flash Plus 2M X 8 FLASH 3V PROM, 55 ns, PDSO40
64 Mbit (x16) Multi-Purpose Flash Plus 2M X 8 FLASH 3V PROM, 55 ns, PBGA48
64 Mbit (x16) Multi-Purpose Flash Plus 2M X 8 FLASH 2.7V PROM, 90 ns, PDSO40
64 Mbit (x16) Multi-Purpose Flash Plus 64兆位（x16）的多功能闪存加
64 Mbit (x16) Multi-Purpose Flash Plus 2M X 8 FLASH 2.7V PROM, 70 ns, PDSO40
|
Silicon Storage Technology, Inc.
SILICON STORAGE TECHNOLOGY INC
|
